ST. LOUIS, Mo. — Nov. 3, 2016 – Barry-Wehmiller companies are packing a lot of information, events, and insight into this year’s Pack Expo schedule.
Pack Expo 2016 marks the debut of a new Barry-Wehmiller initiative, BW Packaging Solutions. Barry-Wehmiller and BW Packaging Solutions will be located at Booth S-2100 at Pack Expo 2016, Nov. 6-9 in Chicago, Ill.
BW Packaging Solutions represents the collective capabilities of several Barry-Wehmiller companies: Accraply, BW Container Systems, Design Group, Hayssen Flexible Systems, Paper Converting Machine Company, Pneumatic Scale Angelus, Synerlink and Thiele Technologies. This collaborative team is committed to tapping their combined insights to help solve packaging challenges. Whether the need is for a brand new line or for upgrades or other solutions that will improve efficiency, flexibility and throughput, this team is a resource to companies large and small.
BW Packaging Solutions capabilities will be represented through five capability zones in Booth S-2100: Primary Packaging, Secondary Packaging, Product and Material Handling, Labeling and Sleeving, and Line Design and Integration (Process and Inspection capabilities will also be represented in the booth, though not in its own zone.) Throughout the show, attendees can pick up a zone card at the booth reception desk and one of our knowledgeable sales representatives will initial the card as they travel through our booth and visit each of the zones. If the card is completed and turned into the booth reception desk, the attendee can qualify for a drawing to win one of three GoPro HERO4 Session cameras.
Barry-Wehmiller and BW Packaging Solutions will host a number of special events during Pack Expo:
- At 10 a.m. on Monday, Nov. 7, Barry-Wehmiller CEO and Chairman Bob Chapman will join the BW Packaging Solutions team for a very special appearance in the booth to sign copies of his Wall-Street Journal bestselling book,Everybody Matters: The Extraordinary Power of Caring for Your People Like Family. Meet Bob and get your own personal copy!
- From 2-3 p.m. on Tuesday, Nov. 8, the breadth of solutions and expertise of BW Packaging Solutions will be on display during a “Packaging Challenge” forum in the Barry-Wehmiller Hospitality Room S-104B. A panel of BW Packaging Solutions experts will discuss customer-submitted packaging-related challenges with Q&A and discussion.
- BW Packaging Solutions companies that provide solutions for the brewing industry will give a special presentation at 11 a.m., Nov. 8 in Booth S-2100.
- Thiele Technologies will take to the Pack Expo Innovation Stage 12 p.m., Wed. Nov. 9 to present “Portable Heating Solution for Packaged Goods,” a self-contained heating solution idea for customer L’Oreal.
In addition, a number of BW Packaging Solutions companies will host in-booth demonstrations throughout the show. For a more detailed schedule and more information about BW Packaging Solutions, go towww.BWPackagingSolutions.com.
Barry-Wehmiller CEO Bob Chapman and Carol O’Neill, Group President, Packaging will also be available for interviews during Pack Expo. Please contact Christi Emmenegger, Director of Communications in advance to schedule time at the show.